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VJ....31/VJ....34 Automotive MLCC
www.vishay.com
6 - BOARD FLEX TEST CONDITIONS
6.1 BOARD FLEX DEFINITIONS OF TEST
PCB thickness = (1.6 ± 0.1) mm
Copper thickness = 35 μm
Material FR4 (EP-GC 02 according to DIN 40 802)
LAYOUT/PAD DESIGN (Dimensions in mm)
Vishay Vitramon
CASE CODE
0603
0805
1206
1210
1812
LL
2.20
3.40
4.50
4.50
4.75
PAD SIZE
LB
1.00
1.30
1.80
2.80
3.60
LEL
0.75
1.20
1.20
1.30
1.50
Note
? LL = total length; LB = width of the pad; LEL = single pad length
LEL
LL
6.2 SOLDERING INSTRUCTIONS
THICKNESS, RECOMMENDED FOR SOLDER PASTE (Reflow soldering)
CASE CODE
0402
0603
0805
1206
1210
1812
THICKNESS in μm
75 to 90
150 to 200
150 to 200
150 to 200
150 to 200
150 to 200
6.3 TYPICAL TEMPERATURE PROFILE FOR REFLOW SOLDERING (Boardflex test)
LEAD (Pb)-FREE S OLDERIN G PROFILE
3 00
MIN. 3 00 s
MAX. 260 °C
MIN. 255 °C
250
T ( S OLID) MIN. 217 °C
200
MIN. 190 °C
MIN. 40 s
150
MIN. 90 s
100
50
RAMP UP
TO 150 °C
MAX. 3 K/s
MIN. 110 s
RAMP DOWN
FROM T ( S OLID)
MAX. 6 K/s
0
0
50
100
150
200
250
3 00
3 50 400
TIME (s)
Revision: 12-Feb-14
18
Document Number: 45040
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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